Semiconductor device packages

ABSTRACT

A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.

BACKGROUND 1. Technical Field

The present disclosure relates to a semiconductor device package. Inparticular, the present disclosure relates to a semiconductor devicepackage including optical devices.

2. Description of the Related Art

A waveguide can be used to guide light from a light emitter to anoptical sensor in a semiconductor device package. The light emitter andthe optical sensor may be disposed in a cavity, or each in a separatecavity, formed in the semiconductor device package. Horizontalmisalignment may occur during placement of the light emitter and theoptical sensor in the cavity or cavities. Further, a depth of the cavityor cavities in the semiconductor device package may not be consistent,such that a depth tolerance of the cavity or cavities may result invertical misalignment of the light emitter, the waveguide and theoptical sensor.

SUMMARY

In an embodiment, a semiconductor device package includes a substrateand an optical device. The optical device includes a first portionextending into the substrate and not extending beyond a first surface ofthe substrate. The optical device further includes a second portionextending along the first surface of the substrate.

In an embodiment, a semiconductor device package includes a substrate, awaveguide and an optical device. The substrate defines a space having abottom surface. The waveguide is disposed in the substrate. The opticaldevice is disposed in the space and is separated from the bottom surfaceof the space by a distance. The optical device includes an alignmentportion extending along a first surface of the substrate and supportedby the first surface of the substrate, and a light emitting or a lightreceiving portion aligned with the waveguide.

In an embodiment, a semiconductor device package includes a substrateand an optical device. The optical device includes a first portionextending into the substrate without protruding from a first surface ofthe substrate, and a second portion extending along the first surface ofthe substrate. The second portion of the optical device is directlydisposed on the first surface of the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a semiconductor device package inaccordance with an embodiment of the present disclosure.

FIG. 2 is a perspective view of a semiconductor device package inaccordance with another embodiment of the present disclosure.

FIG. 3 is a perspective view of a semiconductor device package inaccordance with another embodiment of the present disclosure.

FIG. 4 is a perspective view of a semiconductor device package inaccordance with another embodiment of the present disclosure.

FIG. 5 is a perspective view of a semiconductor device package inaccordance with another embodiment of the present disclosure.

FIG. 6 is a perspective view of a semiconductor device package inaccordance with another embodiment of the present disclosure.

FIG. 7A and FIG. 7B are perspective views of a semiconductor devicepackage in accordance with another embodiment of the present disclosure.

Common reference numerals are used throughout the drawings and thedetailed description to indicate the same or similar elements.Embodiments of the present disclosure will be more apparent from thefollowing detailed description taken in conjunction with theaccompanying drawings.

DETAILED DESCRIPTION

Described in the present disclosure are techniques for providing opticaldevices to improve quality of light transmission. Moreover, thetechniques may improve horizontal and vertical alignments such thatmisalignment between optical components is mitigated.

Spatial descriptions, such as “above,” “below,” “up,” “left,” “right,”“down,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “higher,”“lower,” “upper,” “over,” “under,” and so forth are indicated withrespect to the orientation shown in the figures unless otherwisespecified. It should be understood that the spatial descriptions usedherein are for purposes of illustration only, and that practicalimplementations of the structures described herein can be spatiallyarranged in any orientation or manner, provided that the merits ofembodiments of this disclosure are not deviated by such arrangement.

FIG. 1 is a cross-sectional view of a semiconductor device package 1 inaccordance with an embodiment of the present disclosure. Thesemiconductor device package 1 includes a substrate 10, optical devices11 and 12, a waveguide 13 and two lenses 16.

The substrate 10 has a top surface 101. The substrate 10 includes asemiconductor layer 103 and a semiconductor oxide layer 104 on thesemiconductor layer 103.

The semiconductor layer 103 may include, for example, silicon or anothersuitable material. The semiconductor oxide layer 104 may include, forexample, silicon oxide (SiO_(x)), or another suitable material.

A space 30 is defined by a bottom 31 and side walls 32 of thesemiconductor oxide layer 104. A space 40 is defined by a bottom 41 andside walls 42 of the semiconductor oxide layer 104. The space 30 isseparated from the space 40 by the semiconductor oxide layer 104. Thespace 30 receives or accommodates the optical device 11. An adhesive gel72 may surround a portion of the optical device 11 in the space 30, andfill the space 30 to approximately the bottom of the waveguide 13 andlens 16. The adhesive gel 72 does not touch the waveguide 13 and lens16. An adhesive gel 74 may surround a portion of the optical device 12in the space 40, and fill the space 40 to approximately the bottom ofthe waveguide 13 and 16. The adhesive gel 74 does not touch thewaveguide 13 and lens 16.

The waveguide 13 is disposed within the semiconductor oxide layer 104. Amaterial of the waveguide 13 may be, or may include, a fiber, a polymer,a glass or another suitable material. Light from the optical device 11may be transmitted to the optical device 12 by the waveguide 13, andvice versa. The waveguide 13 may be formed in the substrate 10 beforedisposing the optical device 11 and the optical device 12 in therespective space 30 and space 40. The waveguide 13 may be formed duringa process of manufacturing the substrate 10. The waveguide 13 includes alens 16 at each end for light convergence.

The optical device 11 includes a light emitter (e.g., a light emittingdiode or a laser diode). The optical device 11 may be a light emittingdie. The optical device 11 includes a first portion 111 and a secondportion 112. The first portion 111 and the second portion 112 may be twoportions of a single component, formed integrally (e.g., in a sameprocess stage using a same material). The first portion 111 and thesecond portion 112 may be two separate members which are attachedtogether to form the optical device 11.

The first portion 111 is positioned to extend into the space 30 of thesubstrate 10, and to not extend above the top surface 101 of thesubstrate 10. The optical device 11 is positioned such that the secondportion 112 is laterally protruded from the first portion 111 externalto the substrate 10 and extends along the top surface 101 of thesubstrate 10. The second portion 112 of the optical device 11 issupported by the top surface 101 of the substrate 10 such that the firstportion 111 of the optical device 11 remains at a distance from thebottom 31 of the space 30. The second portion 112 of the optical device11 serves as an alignment portion of the optical device 11.

The first portion 111 has a dimension A (e.g., width), the secondportion 112 has a dimension B (e.g., width), and the space 30 has adimension C (e.g., width). The dimension B is greater than the dimensionA and the dimension C (in other words, B>A and B>C). In someembodiments, the dimension B is greater than the dimension C plus adifference between the dimension C and the dimension A (in other words,B>C+(C−A)).

The first portion 111 of the optical device 11 may include a lightemitting area (not shown in FIG. 1), which may be aligned with thewaveguide 13. The waveguide 13 has a height in a Z direction in an X-Y-Zcoordinate system. The waveguide 13 has a width in an X direction of theX-Y-Z coordinate system (where the X axis extends perpendicularly to theY-Z plane illustrated). With the structure of the optical device 11 asshown, a tolerance of a vertical alignment (e.g., in the Z direction) ofthe light emitting area of the first portion 111 with the waveguide 13may be less than about one third of a vertical dimension (e.g., height)of the waveguide 13 in the Z direction, to prevent optical coupling lossinduced by a vertical offset. In addition, a tolerance of a lateralalignment (e.g., in the X direction) of the light emitting area of thefirst portion 111 with the waveguide 13 may be less than about one thirdof a lateral dimension (e.g., width) of one end of the waveguide 13 inthe X direction, to prevent optical coupling loss induced by a lateraloffset.

If the vertical offset between the light emitting area of the firstportion 111 and the waveguide 13 in the Z direction is greater than orequal to about one third of the vertical dimension (e.g., height) of thewaveguide 13, then light energy received by the waveguide 13 may be lessthan about 10% of light energy emitted by the light emitting area of thefirst portion 111 due to an optical coupling loss induced by thevertical offset. Similarly, if the lateral offset between the lightemitting area of the first portion 111 and the waveguide 13 in the Xdirection is greater than or equal to about one third of the lateraldimension (e.g., width) of the waveguide 13, then light energy receivedby the waveguide 13 may be less than about 10% of light energy emittedby the light emitting area of the first portion 111 due to an opticalcoupling loss induced by the lateral offset. Use of the optical device11 with the first portion 111 and the second portion 112 facilitatesimproved alignment by providing a vertical maneuvering area in the space30 below the first portion 111, and a lateral maneuvering area withinthe space 30 around a periphery of the first portion 111. Accordingly,lateral alignment tolerance does not rely on a manufacturing tolerancerelated to an alignment of the space 30 with the waveguide 13, andvertical alignment tolerance does not rely on a manufacturing tolerancerelated to a depth of the space 30.

The optical device 12 includes an optical detector. The optical device12 includes a first portion 121 and a second portion 122. Portions 121and 122 may be two portions of a single component, formed integrally(e.g., in a same process stage using a same material). Portions 121 and122 may be two separate members which are attached together to form theoptical device 12.

The first portion 121 is positioned to extend into the space 40 of thesubstrate 10, and to not extend above the top surface 101 of thesubstrate 10. The optical device 12 is positioned such that the secondportion 122 is laterally protruded from the portion 121 external to thesubstrate 10 and extends across the top surface 101 of the substrate 10.The second portion 122 of the optical device 12 is supported by the topsurface 101 of the substrate 10 such that the first portion 121 of theoptical device 12 is separated from the bottom 41 of the space 40. Thesecond portion 122 of the optical device 12 serves as an alignmentportion of the optical device 12.

The portion 121 has a dimension D (e.g., width), the portion 122 has adimension E (e.g., width), and the space 40 has a dimension F (e.g.,width). The dimension E is greater than the dimension D and thedimension F (in other words, E>D and E>F). In some embodiments, thedimension E is greater than the dimension F plus a difference betweenthe dimension F and the dimension D (in other words, E>F+(F−D)).

The portion 121 of the optical device 12 may include a light receivingarea (not shown in FIG. 1), which may be aligned with the waveguide 13.With the structure of the optical device 12 as shown, a tolerance of avertical alignment (e.g., in the Z direction) of the light receivingarea of the portion 121 with the waveguide 13 may be less than about onethird of a vertical dimension (e.g., height) of the waveguide 13 in theZ direction, to prevent optical coupling loss induced by a verticaloffset. In addition, a tolerance of a lateral alignment (e.g., in the Xdirection) of the light receiving area of the portion 121 with thewaveguide 13 may be less than about one third of a lateral dimension(e.g., width) of one end of the waveguide 13 in the X direction, toprevent optical coupling loss induced by a lateral offset.

If the vertical offset between the light receiving area of the portion121 and the waveguide 13 in the Z direction is greater than or equal toabout one third of the vertical dimension (e.g., height) of thewaveguide 13, then light energy received by the light receiving area ofthe portion 121 may be less than about 10% of light energy emitted bythe waveguide 13 due to an optical coupling loss induced by the verticaloffset. Similarly, if the lateral offset between the light receivingarea of the portion 121 and the waveguide 13 in the X direction isgreater than or equal to about one third of the lateral dimension (e.g.,width) of the waveguide 13, then light energy received by the lightreceiving area of the portion 121 may be less than about 10% of lightenergy emitted by the waveguide 13 due to an optical coupling lossinduced by the lateral offset.

Use of the optical device 12 with the first portion 121 and the secondportion 122 facilitates improved alignment by providing a verticalmaneuvering area in the space 40 below the portion 121, and a lateralmaneuvering area within the space 40 around a periphery of the portion121. Accordingly, lateral alignment tolerance does not rely on amanufacturing tolerance related to an alignment of the space 40 with thewaveguide 13, and vertical alignment tolerance does not rely on amanufacturing tolerance related to a depth of the space 40.

In one or more embodiments, a refractive index of the waveguide 13 islarger than a refractive index of the semiconductor oxide layer 104. Forexample, a refractive index of SiO_(x) is approximately 1.468, which isless than a refractive index of the waveguide 13. In such anarrangement, transmission loss may be reduced because light transmittedin the waveguide 13 may not enter the semiconductor oxide layer 104.

FIG. 2 is a perspective view of a semiconductor device package 2 inaccordance with an embodiment of the present disclosure. Thesemiconductor device package 2 illustrates an example of an embodimentof the optical device 11 and the substrate 10 of FIG. 1.

In FIG. 2, the second portion 112 of the optical device 11 includes aprotrusion 112 a, and the substrate 10 includes a corresponding groove101 a. The protrusion 112 a is protruded or extended from the secondportion 112 of the optical device 11 in the Z direction, when theoptical device 11 is disposed in the substrate 10. The groove 101 aextends from the top surface 101 into the substrate 10. The protrusion112 a fits into the groove 101 a of the substrate 10. In one or moreembodiments, the protrusion 112 a may be fittedly engaged (e.g., a snugor tight fit) in the groove 101 a of the substrate 10. A design of theprotrusion 112 a and the groove 101 a may facilitate alignment betweenthe optical device 11 and the substrate 10 in the Y direction. Althoughnot shown in FIG. 2, it is contemplated that the optical device 12 mayhave a similar engagement structure to the optical device 11 of FIG. 2(e.g., a protrusion similar to the protrusion 112 a of the opticaldevice 11 and a groove similar to the groove 101 a of the substrate 10).

FIG. 3 is a perspective view of a semiconductor device package 3 inaccordance with an embodiment of the present disclosure. Thesemiconductor device package 3 illustrates an example of an embodimentof the optical device 11 and the substrate 10 of FIG. 1. A protrusion112 a from the second portion 112 of the optical device 11, and a groove101 a in the substrate 10, are similar to the same-numbered features inFIG. 2, and thus are not described again.

In FIG. 3, a protrusion 112 b also extends from the second portion 112,and a groove 101 b in the substrate 10 corresponds to the protrusion 112b. The protrusion 112 b fits into the groove 101 b. In one or moreembodiments, the protrusion 112 b may be fittedly engaged in the groove101 b of the substrate 10. A design of the protrusion 112 b and thegroove 101 b may facilitate alignment between the optical device 11 andthe substrate 10 in the X direction. Although not shown in FIG. 3, it iscontemplated that the optical device 12 may have a similar engagementstructure to the optical device 11 of FIG. 3 (e.g., protrusions similarto the protrusions 112 a/112 b of the optical device 11 and groovessimilar to the grooves 101 a/101 b of the substrate 10).

FIG. 4 is a perspective view of a semiconductor device package 4 inaccordance with an embodiment of the present disclosure. Thesemiconductor device package 4 illustrates an example of an embodimentof the optical device 11 and the substrate 10 of FIG. 1. Protrusions 112a/112 b from the second portion 112 of the optical device 11, andgrooves 101 a/101 b in the substrate 10, are similar to thesame-numbered features in FIG. 3, and thus are not described again.

In FIG. 4, the optical device 11 has a protrusion corresponding to theprotrusion 112 a on an opposite side of the second portion 112 from theprotrusion 112 a, and further has a protrusion corresponding to theprotrusion 112 b on an opposite side of the second portion 112 from theprotrusion 112 b. In other words, there is a protrusion on each of fourdifferent sides of the second portion 112. Stated in a different way,the protrusion 112 a is one of a pair of protrusions 112 a, and theprotrusion 112 b is one of a pair of protrusions 112 b. In like manner,the substrate 10 has four grooves, or a pair of protrusions 101 a and apair of protrusions 101 b. The pair of protrusions 112 a fit into thepair of grooves 101 a, and the pair of protrusions 112 b fit into thepair of grooves 101 b. A design of the various protrusions and groovesmay facilitate alignment between the optical device 11 and the substrate10 in the X and Y directions. Although not shown in FIG. 4, it iscontemplated that the optical device 12 may have a similar engagementstructure to the optical device 11 of FIG. 4 (e.g., protrusions similarto the pairs of protrusions 112 a/112 b of the optical device 11 andgrooves similar to the pairs of grooves 101 a/101 b of the substrate10).

FIG. 5 is a perspective view of a semiconductor device package 5 inaccordance with an embodiment of the present disclosure. Thesemiconductor device package 5 is similar to the semiconductor devicepackage 2 illustrated in FIG. 2, except that a surface 1121 of thesecond portion 112 of the optical device 11 and a surface 1111 of thefirst portion 111 of the optical device 11 are substantially coplanar.Although not shown in FIG. 5, it is contemplated that the optical device12 may have a similar structure to the optical device 11 of FIG. 5(e.g., a surface of the second portion 122 is coplanar with a surface ofthe first portion 121).

FIG. 6 is a perspective view of a semiconductor device package 6 inaccordance with an embodiment of the present disclosure. Thesemiconductor device package 6 illustrates an example of an embodimentof the optical device 11 and the substrate 10 of FIG. 1.

In FIG. 6, the second portion 112 of the optical device 11 includes aprotrusion 112 c and a protrusion 112 d, and the substrate 10 includescorresponding grooves 101 c and 101 d. The protrusions 112 c, 112 d areprotruded or extended from the second portion 112 of the optical device11 in an angled manner at adjacent corners of the second portion 112, inthe Z direction, when the optical device 11 is disposed in the substrate10. The grooves 101 c and 101 d extend from the top surface 101 into thesubstrate 10. The protrusions 112 c and 112 d fit respectively into thegrooves 101 c and 101 d. In one or more embodiments, the protrusions 112c and 112 d may be fittedly engaged in the respective grooves 101 c and101 d. A design of the protrusions 112 c and 112 d and the grooves 101 cand 101 d may facilitate alignment between the optical device 11 and thesubstrate 10 in the X direction and the Y direction. Although not shownin FIG. 6, it is contemplated that the optical device 12 may have asimilar engagement structure to the optical device 11 of FIG. 6 (e.g., aprotrusion similar to the protrusions 112 c and 112 d of the opticaldevice 11 and grooves similar to the grooves 101 c and 101 d of thesubstrate 10).

FIG. 7A is a perspective view of a semiconductor device package 7 inaccordance with an embodiment of the present disclosure. Thesemiconductor device package 7 illustrates an example of an embodimentof the optical device 11 and the substrate 10 of FIG. 1.

In FIG. 7A, the second portion 112 of the optical device 11 furtherincludes protrusions 113 a and 113 b at corners thereof. The twoprotrusions 113 a and 113 b are arranged at two adjacent corners of thesecond portion 112. In one or more embodiments, the two protrusions 113a and 113 b may alternatively be arranged in two opposite corners of thesecond portion 112 of the optical device 11. In one or more embodiments,additional protrusions (in addition to the two protrusions 113 a and 113b) are included in additional corners of the second portion 112 of theoptical device 11. Each of the protrusions 113 a and 113 b (andadditional protrusions) may engage with the substrate 10, such as withcorners of the substrate 10.

FIG. 7B is a perspective view of an assembly of the semiconductor devicepackage 7 as shown in FIG. 7A. After assembling the semiconductor devicepackage 7, the protrusions 113 a and 113 b engage the substrate 10, suchthat corners of the substrate 10 are abutted or confined by theprotrusions 113 a and 113 b. The arrangement of the protrusions 113 aand 113 b may facilitate an alignment between the optical device 11 andthe substrate 10 in the X and/or Y direction.

As used herein, the terms “approximately” and “about” are used todescribe and account for small variations. When used in conjunction withan event or circumstance, the terms can refer to instances in which theevent or circumstance occurs precisely as well as instances in which theevent or circumstance occurs to a close approximation. For example, whenused in conjunction with a numerical value, the terms can encompass arange of variation of less than or equal to ±10% of that numericalvalue, such as less than or equal to ±5%, less than or equal to ±4%,less than or equal to ±3%, less than or equal to ±2%, less than or equalto ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, orless than or equal to ±0.05%. For another example, a first angle may beapproximately the same as a second angle if a difference between thefirst angle and the second angle is less than or equal to ±10°, such as±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°.

Two surfaces can be deemed to be coplanar or substantially coplanar if adisplacement between the two surfaces is no greater than 5 μm, nogreater than 2 μm, no greater than 1 μm, or no greater than 0.5 μm.

Additionally, amounts, ratios, and other numerical values are sometimespresented herein in a range format. It is to be understood that suchrange format is used for convenience and brevity and should beunderstood flexibly to include numerical values explicitly specified aslimits of a range, but also to include all individual numerical valuesor sub-ranges encompassed within that range as if each numerical valueand sub-range is explicitly specified.

While the present disclosure has been described and illustrated withreference to specific embodiments thereof, these descriptions andillustrations do not limit the present disclosure. It should beunderstood by those skilled in the art that various changes may be madeand equivalents may be substituted without departing from the truespirit and scope of the present disclosure as defined by the appendedclaims. The illustrations may not necessarily be drawn to scale. Theremay be distinctions between the artistic renditions in the presentdisclosure and the actual apparatus due to manufacturing processes andtolerances. There may be other embodiments of the present disclosurewhich are not specifically illustrated. The specification and drawingsare to be regarded as illustrative rather than restrictive.Modifications may be made to adapt a particular situation, material,composition of matter, method, or process to the objective, spirit andscope of the present disclosure. All such modifications are intended tobe within the scope of the claims appended hereto. While the methodsdisclosed herein have been described with reference to particularoperations performed in a particular order, it will be understood thatthese operations may be combined, sub-divided, or re-ordered to form anequivalent method without departing from the teachings of the presentdisclosure. Accordingly, unless specifically indicated herein, the orderand grouping of the operations are not limitations of the presentdisclosure.

1. A semiconductor device package, comprising: a substrate having afirst surface; and an optical device comprising a first portionextending into the substrate and under the first surface of thesubstrate, and further comprising a second portion extending along thefirst surface of the substrate.
 2. The semiconductor device package ofclaim 1, wherein the first portion of the optical device has a firstwidth and the second portion of the optical device has a second width,wherein the second width is greater than the first width.
 3. Thesemiconductor device package of claim 1, wherein the second portion ofthe optical device comprises a protrusion and the substrate defines agroove extending from the first surface of the substrate, and whereinthe protrusion of the second portion of the optical device engages withthe groove of the substrate.
 4. The semiconductor device package ofclaim 1, wherein the substrate comprises a semiconductor layer and asemiconductor oxide layer, the semiconductor device package furthercomprising a waveguide disposed in the semiconductor oxide layer.
 5. Thesemiconductor device package of claim 4, wherein the optical devicefurther comprises a light emitting or a light receiving portion alignedwith the waveguide, and a vertical offset between the light emitting orthe light receiving portion and the waveguide is less than about onethird of a width of the waveguide.
 6. The semiconductor device packageof claim 1, wherein the first portion of the optical device is disposedin the substrate.
 7. The semiconductor device package of claim 1,wherein the second portion of the optical device is disposed external tothe substrate.
 8. A semiconductor device package, comprising: asubstrate having a first surface, the substrate defining a space havinga bottom surface; a waveguide in the substrate; and an optical devicedisposed in the space and separated from the bottom surface of the spaceby a distance, the optical device comprising an alignment portionextending along the first surface of the substrate and supported by thefirst surface of the substrate; and a light emitting or a lightreceiving portion aligned with the waveguide.
 9. The semiconductordevice package of claim 8, wherein the light emitting or the lightreceiving portion is aligned with the waveguide within the substrate andbelow the first surface of the substrate.
 10. The semiconductor devicepackage of claim 8, wherein the alignment portion of the optical deviceis disposed directly on the first surface of the substrate.
 11. Thesemiconductor device package of claim 8, wherein the light emitting orthe light receiving portion of the optical device has a first width andthe alignment portion of the optical device has a second width, whereinthe second width is greater than the first width.
 12. The semiconductordevice package of claim 8, wherein the alignment portion of the opticaldevice comprises a protrusion and the substrate defines a grooveextending from the first surface of the substrate, and wherein theprotrusion of the alignment portion of the optical device engages withthe groove of the substrate.
 13. The semiconductor device package ofclaim 8, wherein an offset between the light emitting or the lightreceiving portion and the waveguide is less than about one third of awidth of the waveguide.
 14. A semiconductor device package, comprising:a substrate comprising a first surface; and an optical device comprisinga first portion extending into the substrate without protruding from thefirst surface of the substrate, and a second portion extending along thefirst surface of the substrate; wherein the second portion of theoptical device is directly disposed on the first surface of thesubstrate.
 15. The semiconductor device package of claim 14, wherein thesecond portion of the optical device comprises protrusions, thesubstrate defines grooves, and each protrusion of the second portionfits into a respective groove in the substrate.
 16. The semiconductordevice package of claim 14, wherein the first portion of the opticaldevice has a first width and the second portion of the optical devicehas a second width, wherein the first width is less than the secondwidth.
 17. The semiconductor device package of claim 14, wherein thesecond portion of the optical device comprises a protrusion and thesubstrate defines a groove extending from the first surface of thesubstrate, and wherein the protrusion of the second portion of theoptical device engages with the groove of the substrate.
 18. Thesemiconductor device package of claim 14, further comprising awaveguide, wherein the substrate comprises a semiconductor layer and asemiconductor oxide layer, and the waveguide is disposed in thesemiconductor oxide layer.
 19. The semiconductor device package of claim14, wherein the substrate defines a space and the first portion of theoptical device extends into the space, the semiconductor device packagefurther comprising an adhesive gel in the space and surrounding aperiphery of the first portion of the optical device.
 20. Thesemiconductor device package of claim 19, wherein the space defined bythe substrate has a bottom surface, and the first portion of the opticaldevice does not contact the bottom surface.
 21. The semiconductor devicepackage of claim 8, further comprising an adhesive gel disposed in thespace of the substrate and surrounding a periphery of the light emittingor the light receiving portion of the optical device.
 22. Thesemiconductor device package of claim 21, wherein the adhesive gel fillsthe space of the substrate to a bottom of the waveguide.
 23. Thesemiconductor device package of claim 21, wherein the adhesive gel isnot in direct contact with the waveguide.